Hymite's silicon packaging enables new levels of miniaturization, cost reduction and thermal performance.
 
Hymite designs, develops and manufactures innovative silicon-based wafer-scale packages for high-volume applications including high-brightness LEDs, MEMS and RF. Unlike traditional packaging, the company's innovative silicon packaging enables customers to shrink package size, improve thermal performance, maintain hermeticity, and cut costs through wafer-scale production. Hymite customers include established LED, MEMS and IC manufacturers.