Hymite’s silicon packaging technology is a highly interdisciplinary field requiring a wide range of expertise, from electrical and mechanical engineering to materials science. In manufacturing our packages we use MEMS technology and other advanced techniques, including wafer level assembly and testing. These multiple disciplines foster an environment of innovation and cooperation that makes Hymite a unique and enjoyable place to work. Hymite offers its employees competitive salaries, attractive stock option plans and individual educational and training programs that help staff expand their technical and management opportunities within the company.