Applications
Applications for Hymite Silicon Packaging
Packaging technology remains one of the key challenges to achieving cost-effective electronics products and continuing industry growth. As IC complexity has grown, the importance of the package as a key contributor to performance is still being recognized. Packaging must be smaller, thinner, lighter, and easily manufacturable, with strong attention to thermal issues. Two markets in particular pose a major packaging challenge: LEDs (light emitting diodes) which run very hot and are now seeing greatly increased use across multiple markets including general lighting and mobile consumer equipment; and MEMS (micro-electromechanical systems), small silicon micro machines making their way into consumer, industrial and military equipment - these devices can be susceptible to contamination, heat, magnetism and other external influences.