HyLED is Hymite's packaging technology that meets the requirements of the high-brightness LED market. In additional to being a low-cost solution, HyLED package technology:

• Offers excellent thermal management
• Maintains the small form factor necessary for deployment in LED applications
• Provides optical efficiency
• Can be used with a number of device types found in LED applications, such as wafer, wire-bond or flip chip technologies

The technology behind HyLED^TM is silicon wafers and batch micromachining/metallization processes that deliver package size reductions of up to 4x. Proven IC-style automated manufacturing processes increase throughputs and yields for a lower cost per unit. The option of wafer level assembly and testing for the end-customer introduces huge cost benefits in this high-volume price sensitive consumer sector.

Additionally, silicon has excellent inherent thermal management characteristics. Hymite's engineers provide optimized designs alleviating thermal and thermo-mechanical stress for excellent performance, even for the most demanding operation conditions. Unlike other package technologies, the micromachined LED cavity acts as a reflector, thermal conductor and reservoir for silicone.

Hymite A/S Announces Innovative Silicon-Based Packaging Solution for High-Volume Production of High-Brightness LEDs at Low Cost.

Read our white paper about HyLED^TM