Technology

Hymite is the first company to offer commercially available silicon packaging, produced at wafer level. The technology is based on industry-proven, cost-effective solutions that address the packaging challenges of LEDs, MEMs and RF devices. The technology uses IC-style batch manufacturing processes that provide package miniaturization, reduced labor costs and hermetic sealing. The incorporation of micro-vias into the silicon package alleviates thermal and thermal-mechanical effects for excellent performance, even for hot devices.

Technical Papers

• High Frequency Behavior of Micro-vias (Presented at ECTC 2005)

• Wafer Level Hermetic Packaging of Magnetic Proximity Switches (Presented at IMAPS 04)
  
  
• Optical Leak Detection for Wafer Level Hermeticity Testing (Presented at SEMICON 2004)

Hymite A/S Announces Innovative Silicon-Based Packaging Solution for High-Volume Production of High-Brightness LEDs at Low Cost.