Technology

Hymite is the first company to offer commercially available silicon packaging, produced at wafer level. The technology is based on industry-proven, cost-effective solutions that address the packaging challenges of LEDs. The technology uses IC-style batch manufacturing processes that provide package miniaturization, reduced labor costs and hermetic sealing. The incorporation of micro-vias into the silicon package alleviates thermal and thermal-mechanical effects for excellent performance, even for hot devices.

Hymite A/S Announces Innovative Silicon-Based Packaging Solution for High-Volume Production of High-Brightness LEDs at Low Cost.