Hymite's state-of-the art fab and equipment line has enabled the company to achieve unprecendented levels of package miniaturization using wafer-level production techniques that reduce cost.
• Wafer processing
– 100m2 class 100/1000
– additional 1000m2 shared 100/1000
– substrate sizes
100 and 150 mm
• Packaging
– 60m2 class
100/1000
• Testing
– 60m2 class 100000